ABOUT

JIAFENG AUTIOMATION


SINCE 2001

Dalian Jiafeng Automation Co., Ltd., founded in 2001, is a high-tech enterprise manufacturing high-end semiconductor rear packaging equipment. It is a national specialized and new "little giant" enterprise supported by the Ministry of industry and information technology, a gazelle enterprise in Liaoning Province, a supporting unit of the national local joint engineering research center of large-scale integrated circuit packaging equipment, and a sponsor of Dalian integrated circuit packaging equipment innovation center.


Plant area

Office area

Staff

Product series

The company has undertaken a number of national 02 special projects and provincial and municipal projects, filling a number of gaps in domestic IC rear packaging equipment

More +

Technology Center

The company has undertaken a number of national 02 special projects and provincial and municipal projects, filling a number of gaps in domestic IC rear packaging equipment

More +

Contact us

The company has undertaken a number of national 02 special projects and provincial and municipal projects, filling a number of gaps in domestic IC rear packaging equipment

More +

PRODUCTS

Products
The company has undertaken a number of national 02 special projects and provincial and municipal projects,
filling a number of gaps in domestic IC rear packaging equipment
More +

HONOR

Honor
The company has undertaken a number of national 02 special projects and provincial and municipal projects,
filling a number of gaps in domestic IC rear packaging equipment
National specialized new

National specialized new "little giant" enterprise

The 9th semiconductor innovation products and technologies

The 9th semiconductor innovation products and technologies

The 10th (2015) China Semiconductor innovation product and Technology Award - full automatic wire marking machine for thick aluminum wire

The 10th (2015) China Semiconductor innovation product and Technology Award - full automatic wire marking machine for thick aluminum wire

The 3rd semiconductor innovation products and technologies

The 3rd semiconductor innovation products and technologies

More +

NEWS INFORMATION

News
The company has undertaken a number of national 02 special projects and provincial and municipal projects,
filling a number of gaps in domestic IC rear packaging equipment

RECRUIT

Recruit
The company has undertaken a number of national 02 special projects and provincial and municipal projects,
filling a number of gaps in domestic IC rear packaging equipment

Duty:

Research and implementation of motion dynamic analysis and control algorithm for semiconductor packaging equipment

Duty:

1.Using computer vision and image processing technology to solve the problems of automatic positioning, automatic defect detection and classification in semiconductor packaging equipment...

Duty:

Develop and improve semiconductor packaging process, and put forward detailed process requirements for the design and continuous improvement of packaging equipment

Duty:

Responsible for developing application software for semiconductor packaging equipment, including human-computer interface of equipment and program design and development of equipment workflow...

More +