Process Engineer
Job responsibilities:
Develop and improve semiconductor packaging process, and put forward detailed process requirements for the design and continuous improvement of die bonder
Job requirements:
1.Master degree in materials / machinery / Physics
2.Strong ability of experiment, data processing and analysis
3.Familiar with DOE, SPC, 8D and fema analysis tools
4.Strong sense of responsibility and good communication skills
Address: No. 27, Fuquan North Road, Jinzhou
District, Liaoning Province, China
E-mail：dfq@jafeng.cn
Tel：0411-88035916
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