图片名称

Duty:

Research and implementation of motion dynamic analysis and control algorithm for semiconductor packaging equipment

Duty:

1.Using computer vision and image processing technology to solve the problems of automatic positioning, automatic defect detection and classification in semiconductor packaging equipment...

Duty:

Develop and improve semiconductor packaging process, and put forward detailed process requirements for the design and continuous improvement of packaging equipment

Duty:

Responsible for developing application software for semiconductor packaging equipment, including human-computer interface of equipment and program design and development of equipment workflow...

Duty:

Research, design and develop electronic and electrical devices and modules related to semiconductor packaging equipment, as well as later board level debugging and corresponding system testing

Duty:

Design and develop high-precision and dynamic mechanical platforms and modules for semiconductor packaging equipment

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