2022-04-14
Duty：
Research and implementation of motion dynamic analysis and control algorithm for semiconductor packaging equipment
2022-04-14
Duty：
1.Using computer vision and image processing technology to solve the problems of automatic positioning, automatic defect detection and classification in semiconductor packaging equipment...
2022-04-14
Duty：
Develop and improve semiconductor packaging process, and put forward detailed process requirements for the design and continuous improvement of packaging equipment
2022-04-14
Duty：
Responsible for developing application software for semiconductor packaging equipment, including human-computer interface of equipment and program design and development of equipment workflow...
2022-04-14
Duty：
Research, design and develop electronic and electrical devices and modules related to semiconductor packaging equipment, as well as later board level debugging and corresponding system testing
2022-03-23
Duty：
Design and develop high-precision and dynamic mechanical platforms and modules for semiconductor packaging equipment
Address: No. 27, Fuquan North Road, Jinzhou
District, Liaoning Province, China
E-mail：dfq@jafeng.cn
Tel：0411-88035916
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